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dc.contributor.advisorChairperson, Graduate Committee: Brock LaMeres.en
dc.contributor.authorMcIntosh, Christopher Michael.en
dc.date.accessioned2013-06-25T18:40:27Z
dc.date.available2013-06-25T18:40:27Z
dc.date.issued2009en
dc.identifier.urihttps://scholarworks.montana.edu/xmlui/handle/1/1833
dc.description.abstractThe electrical parasitics of traditional integrated circuit (IC) packaging methods are a known bottleneck to overall system performance. The parasitic inductance and capacitance of traditional package interconnect such as wire bonds, create noise sources which ultimately limit the speed at which a digital system can run. Recent advances in package interconnect have reduced these parasitics by moving to a System-in-Package (SiP) approach. In SiP, multiple IC dies are connect directly to each other and encapsulated within the same package. This improves performance by eliminating the need for board-level interconnect. While SiP has made significant progress in reducing the interconnect parasitics, IC dies are still connected using traditional methods such as wire bonds. The unshielded nature of the wire bond leads to noise sources such as coupling, simultaneous switching noise, and reflections. This thesis presents a new interconnect methodology which aims at improving the signaling speeds between dies within SiP. This new system uses a miniature coaxial cable that connects to on-chip coplanar waveguides on a silicon substrate. The coaxial-to-coplanar transition is accomplished using an anisotropic etch along the perimeter of the silicon substrate. This approach provides the electrical and mechanical mating of the on and off chip conductors. This system yields a fully shielded, matched impedance signal path in addition to a low impedance return path. This approach shows reduction of the three main sources of electrical noise in SiP and leads to a significant improvement in system performance.en
dc.language.isoengen
dc.publisherMontana State University - Bozeman, College of Engineeringen
dc.subject.lcshSession Initiation Protocol (Computer network protocol).en
dc.subject.lcshCoaxial cables.en
dc.titleNovel die-to-die coaxial interconnect system for use in System-in-Package applications
dc.typeThesis
dc.rights.holderCopyright Christopher Michael McIntosh 2009en
thesis.catalog.ckey1404355en
thesis.degree.committeemembersMembers, Graduate Committee: Andy Olson; Todd Kaiseren
thesis.degree.departmentElectrical & Computer Engineering.en
thesis.degree.genreThesisen
thesis.degree.nameMSen
thesis.format.extentfirstpage1en
thesis.format.extentlastpage53en
mus.identifier.categoryEngineering & Computer Science
mus.relation.departmentElectrical & Computer Engineering.en_US
mus.relation.universityMontana State University - Bozemanen_US


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